01324nam a2200205Ia 4500 CTU_154936 210402s9999 xx 000 0 und d 2846000 621.381046 C411 Ceramic interconnect technology handbook Edited by Fred D. Barlow III, Aicha Elshabini Boca Raton CRC Press/Taylor & Francis 2007 Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies Electronic ceramics,Electronic packaging,Interconnects (Integrated circuit technology),Kỹ thuật truyền thông điện tử,Kết nối (Kỹ thuật nối mạch điện) Materials,Design and construction Nguyên Trung tâm Học liệu Trường Đại học Cần Thơ