01230nam a2200205Ia 4500 CTU_97184 210402s9999 xx 000 0 und d 2399000 621.9 L693 Liang, Hong Tribology in chemical mechanical planarization Hong Liang, David Craven London Taylor and Francis 2004 Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology Tribology,Grinding and polishing M.Loan Trung tâm Học liệu Trường Đại học Cần Thơ