(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.
Trích dẫn kiểu ChicagoMaterials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.
MLA引文Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.
警告:這些引文格式不一定是100%准確.