Cita APA

(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.

Citación estilo Chicago

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Cita MLA

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Cảnh báo: Các trích dẫn này có thể không phải lúc nào cũng chính xác 100%.