Dyfyniad APA

(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.

Dyfyniad Arddull Chicago

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Dyfyniad MLA

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Rhybudd: Mae'n bosib nad yw'r dyfyniadau hyn bob amser yn 100% cywir.