Παραπομπή APA

(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.

Παραπομπή Chicago Style

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Παραπομπή MLA

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Πρόσοχή: Οι παραπομπές μπορεί να μην είναι 100% ακριβείς.