(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.
Citação norma ChicagoMaterials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.
Citação norma MLAMaterials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.
Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.