Cita APA

(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.

Chicago Style Citation

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Cita MLA

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Atenció: Aquestes cites poden no estar 100% correctes.