Style de citation APA

(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.

Style de citation Chicago

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Style de citation MLA

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Attention : ces citations peuvent ne pas être correctes à 100%.