(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.
Chicago Style CitationMaterials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.
Cita MLAMaterials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.
Atenció: Aquestes cites poden no estar 100% correctes.