APA-referens

(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.

Chicago-stil citat

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

MLA-referens

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

Varning: dessa hänvisningar är inte alltid fullständigt riktiga.