APA引文

(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.

Trích dẫn kiểu Chicago

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

MLA引文

Materials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.

警告：這些引文格式不一定是100％准確.