(1990). Materials for high-density electronic packaging and interconnection. New York: National Academy Press.
Chicago-stil citatMaterials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.
MLA-referensMaterials for High-density Electronic Packaging and Interconnection. New York: National Academy Press, 1990.
Varning: dessa hänvisningar är inte alltid fullständigt riktiga.