APA Citation

Chen, C., Tong, H., & Tu K.N. Electromigration and thermomigration in pb-free flip-chip solder joints.

Chicago Style Citation

Chen, Chih., H.M Tong, and Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.

MLA Citation

Chen, Chih., H.M Tong, and Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.

Warning: These citations may not always be 100% accurate.