APA引文

Chen, C., Tong, H., & Tu K.N. Electromigration and thermomigration in pb-free flip-chip solder joints.

Trích dẫn kiểu Chicago

Chen, Chih., H.M Tong, và Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.

MLA引文

Chen, Chih., H.M Tong, và Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.

警告：這些引文格式不一定是100％准確.