Chen, C., Tong, H., & Tu K.N. Electromigration and thermomigration in pb-free flip-chip solder joints.
استشهاد بنمط شيكاغوChen, Chih., H.M Tong, و Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.
MLA استشهادChen, Chih., H.M Tong, و Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.