APA Alıntı

Chen, C., Tong, H., & Tu K.N. Electromigration and thermomigration in pb-free flip-chip solder joints.

Chicago Stili Alıntı

Chen, Chih., H.M Tong, ve Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.

MLA Alıntı

Chen, Chih., H.M Tong, ve Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.