APA Citatie

Chen, C., Tong, H., & Tu K.N. Electromigration and thermomigration in pb-free flip-chip solder joints.

Chicago Style citaat

Chen, Chih., H.M Tong, en Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.

MLA citatie

Chen, Chih., H.M Tong, en Tu K.N. Electromigration and Thermomigration in Pb-free Flip-chip Solder Joints.

Let op: Deze citaties zijn niet altijd 100% accuraat.