<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>01332nam a2200277Ia 4500</leader>
  <controlfield tag="001">TVU_20722</controlfield>
  <controlfield tag="008">210423s9999    xx            000 0 und d</controlfield>
  <datafield tag="020" ind1=" " ind2=" ">
   <subfield code="a">0470499206</subfield>
  </datafield>
  <datafield tag="020" ind1=" " ind2=" ">
   <subfield code="a">9780470499207</subfield>
  </datafield>
  <datafield tag="041" ind1=" " ind2=" ">
   <subfield code="a">eng</subfield>
  </datafield>
  <datafield tag="082" ind1=" " ind2=" ">
   <subfield code="a">668.423</subfield>
  </datafield>
  <datafield tag="082" ind1=" " ind2=" ">
   <subfield code="b">E204</subfield>
  </datafield>
  <datafield tag="100" ind1=" " ind2=" ">
   <subfield code="a">Engelmann, Sven</subfield>
  </datafield>
  <datafield tag="245" ind1=" " ind2="0">
   <subfield code="a">Advanced thermoforming</subfield>
  </datafield>
  <datafield tag="245" ind1=" " ind2="0">
   <subfield code="b">methods, machines and materials, applications and automation</subfield>
  </datafield>
  <datafield tag="245" ind1=" " ind2="0">
   <subfield code="c">Sven Engelmann</subfield>
  </datafield>
  <datafield tag="260" ind1=" " ind2=" ">
   <subfield code="a">Hoboken, N.J.</subfield>
  </datafield>
  <datafield tag="260" ind1=" " ind2=" ">
   <subfield code="b">John Wiley &amp; Sons</subfield>
  </datafield>
  <datafield tag="260" ind1=" " ind2=" ">
   <subfield code="c">2012</subfield>
  </datafield>
  <datafield tag="300" ind1=" " ind2=" ">
   <subfield code="a">xi, 335 p.</subfield>
  </datafield>
  <datafield tag="300" ind1=" " ind2=" ">
   <subfield code="b">ill.</subfield>
  </datafield>
  <datafield tag="300" ind1=" " ind2=" ">
   <subfield code="c">24 cm</subfield>
  </datafield>
  <datafield tag="520" ind1=" " ind2=" ">
   <subfield code="a">This guide gives an overview and insight into the advanced technology of thermoforming, discussing different processes and applications. It reveals the possibilities of thermoforming from forming, filling, and sealing processes, to using thermoforming technology for cost saving purposes and maximum efficiency. Its coverage addresses the simulation of formed parts as well as applications of technical parts and packaging. The reader is guided through the path of development, design, machine and mold technology and production, as well as the latest innovations, from thermoformed bottles to fully automated assembly lines</subfield>
  </datafield>
  <datafield tag="650" ind1=" " ind2=" ">
   <subfield code="a">Thermoforming</subfield>
  </datafield>
  <datafield tag="700" ind1=" " ind2=" ">
   <subfield code="a">Sven Engelmann</subfield>
  </datafield>
  <datafield tag="980" ind1=" " ind2=" ">
   <subfield code="a">Trung tâm Học liệu Trường Đại học Trà Vinh</subfield>
  </datafield>
 </record>
</collection>
