Lee, T., Bieler, T., & Kim, C. (2015). Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer.
استشهاد بنمط شيكاغوLee, T.-K, Th.R Bieler, و C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.
MLA استشهادLee, T.-K, Th.R Bieler, و C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.