Cita APA

Lee, T., Bieler, T., & Kim, C. (2015). Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer.

Chicago Style Citation

Lee, T.-K, Th.R Bieler, i C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.

Cita MLA

Lee, T.-K, Th.R Bieler, i C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.