Lee, T., Bieler, T., & Kim, C. (2015). Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer.
Παραπομπή Chicago StyleLee, T.-K, Th.R Bieler, και C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.
Παραπομπή MLALee, T.-K, Th.R Bieler, και C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.
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