Lee, T., Bieler, T., & Kim, C. (2015). Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer.
Chicago Style CitationLee, T.-K, Th.R Bieler, and C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.
MLA CitationLee, T.-K, Th.R Bieler, and C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.
Warning: These citations may not always be 100% accurate.