Citação norma APA

Lee, T., Bieler, T., & Kim, C. (2015). Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer.

Citação norma Chicago

Lee, T.-K, Th.R Bieler, e C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.

Citação norma MLA

Lee, T.-K, Th.R Bieler, e C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.

Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.