APA引文

Lee, T., Bieler, T., & Kim, C. (2015). Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer.

Trích dẫn kiểu Chicago

Lee, T.-K, Th.R Bieler, và C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.

MLA引文

Lee, T.-K, Th.R Bieler, và C.-U Kim. Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability. Springer, 2015.

警告：这些引文格式不一定是100％准确.