Cita APA

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Chicago Style Citation

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

Cita MLA

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

Atenció: Aquestes cites poden no estar 100% correctes.