Dyfyniad APA

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Dyfyniad Arddull Chicago

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

Dyfyniad MLA

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

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