Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.
Chicago Style CitationGreig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.
MLA CitationGreig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.
Warning: These citations may not always be 100% accurate.