Cita APA

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Citación estilo Chicago

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

Cita MLA

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

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