APA aipamena

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Chicago Style aipamena

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

MLA aipamena

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

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