Style de citation APA

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Style de citation Chicago

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

Style de citation MLA

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

Attention : ces citations peuvent ne pas être correctes à 100%.