APA ציטוט

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Trích dẫn kiểu Chicago

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

ציטוט MLA

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.