एपीए उद्धरण

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

शिकागो स्टाइल उद्धरण

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

एमएलए उद्धरण

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.