Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.
シカゴスタイル引用形Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.
MLA引用形式Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.
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