APA Citatie

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Chicago Style citaat

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

MLA citatie

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

Let op: Deze citaties zijn niet altijd 100% accuraat.