Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.
Trích dẫn kiểu ChicagoGreig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.
MLA citiranjeGreig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.
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