Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.
Chicago-stil citatGreig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.
MLA-referensGreig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.
Varning: dessa hänvisningar är inte alltid fullständigt riktiga.