APA Alıntı

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Chicago Stili Alıntı

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

MLA Alıntı

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

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