APA引文

Greig, W. (2020). Integrated Circuit Packaging, Assembly and Interconnections. Springer US.

Trích dẫn kiểu Chicago

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

MLA引文

Greig, William. Integrated Circuit Packaging, Assembly and Interconnections. Springer US, 2020.

警告：这些引文格式不一定是100％准确.