Cita APA

Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.

Chicago Style Citation

Kuang, Ken, i Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

Cita MLA

Kuang, Ken, i Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

Atenció: Aquestes cites poden no estar 100% correctes.