Dyfyniad APA

Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.

Dyfyniad Arddull Chicago

Kuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

Dyfyniad MLA

Kuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

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