Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.
Chicago Style CitationKuang, Ken, and Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
MLA CitationKuang, Ken, and Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
Warning: These citations may not always be 100% accurate.