Cita APA

Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.

Citación estilo Chicago

Kuang, Ken, y Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

Cita MLA

Kuang, Ken, y Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

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