APA aipamena

Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.

Chicago Style aipamena

Kuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

MLA aipamena

Kuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

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