Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.
Style de citation ChicagoKuang, Ken, et Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
Style de citation MLAKuang, Ken, et Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
Attention : ces citations peuvent ne pas être correctes à 100%.