Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.
Trích dẫn kiểu ChicagoKuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
Deismireacht MLAKuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
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