APA ציטוט

Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.

Trích dẫn kiểu Chicago

Kuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

ציטוט MLA

Kuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.