Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.
शिकागो स्टाइल उद्धरणKuang, Ken, और Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
एमएलए उद्धरणKuang, Ken, और Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
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