Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.
シカゴスタイル引用形Kuang, Ken, , Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
MLA引用形式Kuang, Ken, , Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.
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