APA引文

Kuang, K., & Sturdivant, R. (2020). RF and Microwave Microelectronics Packaging II. Springer International Publishing.

Trích dẫn kiểu Chicago

Kuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

MLA引文

Kuang, Ken, và Rick Sturdivant. RF and Microwave Microelectronics Packaging II. Springer International Publishing, 2020.

警告：这些引文格式不一定是100％准确.