Wang, R., & Chakrabarty, K. (2020). Testing of Interposer-Based 2.5D Integrated Circuits. Springer International Publishing.
استشهاد بنمط شيكاغوWang, Ran, و Krishnendu Chakrabarty. Testing of Interposer-Based 2.5D Integrated Circuits. Springer International Publishing, 2020.
MLA استشهادWang, Ran, و Krishnendu Chakrabarty. Testing of Interposer-Based 2.5D Integrated Circuits. Springer International Publishing, 2020.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.