APA引文

Wang, R., & Chakrabarty, K. (2020). Testing of Interposer-Based 2.5D Integrated Circuits. Springer International Publishing.

Trích dẫn kiểu Chicago

Wang, Ran, và Krishnendu Chakrabarty. Testing of Interposer-Based 2.5D Integrated Circuits. Springer International Publishing, 2020.

MLA引文

Wang, Ran, và Krishnendu Chakrabarty. Testing of Interposer-Based 2.5D Integrated Circuits. Springer International Publishing, 2020.

警告：这些引文格式不一定是100％准确.