Chien, B., & Hong, T. (2020). Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg.
استشهاد بنمط شيكاغوChien, Been-Chian, و Tzung-Pei Hong. Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg, 2020.
MLA استشهادChien, Been-Chian, و Tzung-Pei Hong. Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg, 2020.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.