Chien, B., & Hong, T. (2020). Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg.
Trích dẫn kiểu ChicagoChien, Been-Chian, và Tzung-Pei Hong. Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg, 2020.
Deismireacht MLAChien, Been-Chian, và Tzung-Pei Hong. Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg, 2020.
Rabhadh: D'fhéadfadh nach mbeadh na deismireachtaí seo 100% cruinn i gcónaí.