Chien, B., & Hong, T. (2020). Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg.
Trích dẫn kiểu ChicagoChien, Been-Chian, và Tzung-Pei Hong. Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg, 2020.
MLA引文Chien, Been-Chian, và Tzung-Pei Hong. Opportunities and Challenges for Next-Generation Applied Intelligence. Springer Berlin Heidelberg, 2020.
警告:这些引文格式不一定是100%准确.