Opportunities and Challenges for Next-Generation Applied Intelligence

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Hlavní autoři: Chien, Been-Chian, Hong, Tzung-Pei
Médium: Kniha
Jazyk:English
Vydáno: Springer Berlin Heidelberg 2020
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On-line přístup:https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/84416
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Thư viện lưu trữ: Thư viện Trường Đại học Đà Lạt
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spelling oai:scholar.dlu.edu.vn:DLU123456789-844162023-10-06T04:34:56Z Opportunities and Challenges for Next-Generation Applied Intelligence Chien, Been-Chian Hong, Tzung-Pei Engineering Mathematical and Computational Engineering 2020-02-24T09:54:12Z 2020-02-24T09:54:12Z 2009 Book 978-3-540-92813-3 978-3-540-92814-0 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/84416 en Studies in Computational Intelligence Springer-Verlag Berlin Heidelberg application/pdf Springer Berlin Heidelberg
institution Thư viện Trường Đại học Đà Lạt
collection Thư viện số
language English
topic Engineering
Mathematical and Computational Engineering
spellingShingle Engineering
Mathematical and Computational Engineering
Chien, Been-Chian
Hong, Tzung-Pei
Opportunities and Challenges for Next-Generation Applied Intelligence
format Book
author Chien, Been-Chian
Hong, Tzung-Pei
author_facet Chien, Been-Chian
Hong, Tzung-Pei
author_sort Chien, Been-Chian
title Opportunities and Challenges for Next-Generation Applied Intelligence
title_short Opportunities and Challenges for Next-Generation Applied Intelligence
title_full Opportunities and Challenges for Next-Generation Applied Intelligence
title_fullStr Opportunities and Challenges for Next-Generation Applied Intelligence
title_full_unstemmed Opportunities and Challenges for Next-Generation Applied Intelligence
title_sort opportunities and challenges for next-generation applied intelligence
publisher Springer Berlin Heidelberg
publishDate 2020
url https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/84416
_version_ 1819799385042583552