Copper Interconnect Technology
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Springer New York
2020
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oai:scholar.dlu.edu.vn:DLU123456789-853122023-10-06T05:42:24Z Copper Interconnect Technology Gupta, Tapan Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Circuits and Systems 2020-02-24T10:37:18Z 2020-02-24T10:37:18Z 2009 Book 978-1-4419-0075-3 978-1-4419-0076-0 https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85312 en Springer-Verlag New York application/pdf Springer New York |
institution |
Thư viện Trường Đại học Đà Lạt |
collection |
Thư viện số |
language |
English |
topic |
Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Circuits and Systems |
spellingShingle |
Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Circuits and Systems Gupta, Tapan Copper Interconnect Technology |
format |
Book |
author |
Gupta, Tapan |
author_facet |
Gupta, Tapan |
author_sort |
Gupta, Tapan |
title |
Copper Interconnect Technology |
title_short |
Copper Interconnect Technology |
title_full |
Copper Interconnect Technology |
title_fullStr |
Copper Interconnect Technology |
title_full_unstemmed |
Copper Interconnect Technology |
title_sort |
copper interconnect technology |
publisher |
Springer New York |
publishDate |
2020 |
url |
https://scholar.dlu.edu.vn/thuvienso/handle/DLU123456789/85312 |
_version_ |
1819830830064730112 |