Style de citation APA

Li, Y., & Goyal, D. (2020). 3D Microelectronic Packaging. Springer International Publishing.

Style de citation Chicago

Li, Yan, et Deepak Goyal. 3D Microelectronic Packaging. Springer International Publishing, 2020.

Style de citation MLA

Li, Yan, et Deepak Goyal. 3D Microelectronic Packaging. Springer International Publishing, 2020.

Attention : ces citations peuvent ne pas être correctes à 100%.