Cita APA

Li, Y., & Goyal, D. (2020). 3D Microelectronic Packaging. Springer International Publishing.

Chicago Style Citation

Li, Yan, i Deepak Goyal. 3D Microelectronic Packaging. Springer International Publishing, 2020.

Cita MLA

Li, Yan, i Deepak Goyal. 3D Microelectronic Packaging. Springer International Publishing, 2020.

Atenció: Aquestes cites poden no estar 100% correctes.