APA Citation

Li, Y., & Goyal, D. (2020). 3D Microelectronic Packaging. Springer International Publishing.

Chicago Style Citation

Li, Yan, and Deepak Goyal. 3D Microelectronic Packaging. Springer International Publishing, 2020.

MLA Citation

Li, Yan, and Deepak Goyal. 3D Microelectronic Packaging. Springer International Publishing, 2020.

Warning: These citations may not always be 100% accurate.