APA引文

Li, Y., & Goyal, D. (2020). 3D Microelectronic Packaging. Springer International Publishing.

Trích dẫn kiểu Chicago

Li, Yan, và Deepak Goyal. 3D Microelectronic Packaging. Springer International Publishing, 2020.

MLA引文

Li, Yan, và Deepak Goyal. 3D Microelectronic Packaging. Springer International Publishing, 2020.

警告：这些引文格式不一定是100％准确.