Cita APA

Seok, S. (2020). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering. Springer International Publishing.

Chicago Style Citation

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based On Adhesion Engineering. Springer International Publishing, 2020.

Cita MLA

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based On Adhesion Engineering. Springer International Publishing, 2020.

Atenció: Aquestes cites poden no estar 100% correctes.