Cita APA

Seok, S. (2020). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering. Springer International Publishing.

Citación estilo Chicago

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based On Adhesion Engineering. Springer International Publishing, 2020.

Cita MLA

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based On Adhesion Engineering. Springer International Publishing, 2020.

Precaución: Estas citas no son 100% exactas.