Citazione APA

Seok, S. (2020). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering. Springer International Publishing.

Stile di citazione Chicago

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based On Adhesion Engineering. Springer International Publishing, 2020.

Citazione MLA

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based On Adhesion Engineering. Springer International Publishing, 2020.

Attenzione: Queste citazioni potrebbero non essere precise al 100%.